Monolithic 3D (M3D) integration can result in reduced chip area and higher performance when compared to 3D die stacking based on through-silicon vias. Due to the benefits of M3D integration, there is growing interest in industry towards the adoption of this technology. However, test challenges for M3D integration have remained largely unexplored. This talk will present three key test challenges for M3D integration: (i) performance variations due to high-density integration, (ii) defect analysis and modeling, and (iii) defect isolation and yield enhancement. Specific design-for-test and built-in self-test and solutions for these challenges will be presented.

Krishnendu Chakrabarty received the B. Tech. degree from the Indian Institute of Technology, Kharagpur, in 1990, and the M.S.E. and Ph.D. degrees from the University of Michigan, Ann Arbor, in 1992 and 1995, respectively. He is now the William H. Younger Distinguished Professor and Chair in the Department of Electrical and Computer Engineering and Professor of Computer Science at Duke University. Prof. Chakrabarty is a recipient of the National Science Foundation CAREER award, the Office of Naval Research Young Investigator award, the Humboldt Research Award from the Alexander von Humboldt Foundation, Germany, the IEEE Transactions on CAD Donald O. Pederson Best Paper award (2015), the ACM Transactions on Design Automation of Electronic Systems Best Paper Award (2017) and over a dozen best paper awards at major IEEE conferences. He is a Fellow of ACM, a Fellow of IEEE, and a Golden Core Member of the IEEE Computer Society. Prof. Chakrabarty served as the Editor-in-Chief of IEEE Design & Test of Computers during 2010-2012 and ACM Journal on Emerging Technologies in Computing Systems during 2010-2015. Currently he serves as the Editor-in-Chief of IEEE Transactions on VLSI Systems. He is also an Associate Editor of IEEE Transactions on Biomedical Circuits and Systems, IEEE Transactions on Multiscale Computing Systems, and ACM Transactions on Design Automation of Electronic Systems.